tagged w/ IC
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We thought about in our website write who we are or about us but I guess is better when you can know us and look what we do for you, these are our people, your people. Each time you need an IR Soldering Station, all these people are thinking about what you need and making sure they do the best job for what you need.
These are YOUR PEOPLE.
puhuit.com
info@puhuit.com
Technologies going beyondWe thought about in our website write who we are or about us but I guess is better... more
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DGCTV
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2 years ago
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DGC Media for 2009 presents a new Educational Series dedicated to interact directly with our customer, These series are dedicated to help you with you procedures of reballing, rework, reflow and all about soldering and welding
TAGS:
Reballing BGA Chip Reflow Rework SOP SOJ QFP PLCC Mini BGA
Dragon Group China Kada Supreme, ACHI IR-3 Jovy RE 7500
Smart Digital Puhui Taian Soldering Iron 939 T-870 900IIb 3.0vDGC Media for 2009 presents a new Educational Series dedicated to interact directly... more
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DGCTV
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2 years ago
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Here is a preview of how are the BGA Soldering Rework Station and the Reflow Ovens made, from the beginning, the metal plate, to the end, when the machines pass 3 days in Quality Control each one.Here is a preview of how are the BGA Soldering Rework Station and the Reflow Ovens... more
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DGCTV
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2 years ago
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DGC Media for 2009 presents a new Educational Series dedicated to interact directly with our customer, This series are dedicated to help you with you procedures of reballing, rework, from the beginning. Chose the right machine for the job, the right accessories and parts and perform a clean cut procedure that guarantees the best functionality for the chips and motherboards. This is just a video of the USE of the T-870 2 in 1. This machine can work with kind of chips from 30 to 55mm. BGA - SMT - SMD - SOP - QFP - SOJ - PLCC With an infrared area of basic 30 * 55 mm , and 11 Kg of weight, this is the big one of the Multi Purpose IC INFRARED IRDA Welders. 850W of heating power, Output of 1000W and a heating plate of 240*180mm.This rework station is ESD-Safe and it is made of metal and coated with a static-dissipative paint and allows for Soldering and desoldering all types of chips.DGC Media for 2009 presents a new Educational Series dedicated to interact directly... more
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DGCTV
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added this
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2 years ago
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DGC Media for 2009 presents a new Educational Series dedicated to interact directly with our customer, This series are dedicated to help you with you procedures of reballing, rework, from the beginning. Chose the right machine for the job, the right accessories and parts and perform a clean cut procedure that guarantees the best functionality for the chips and motherboards. This is just a video of the USE of the T-870 2 in 1. This machine can work with kind of chips from 30 to 55mm. BGA - SMT - SMD - SOP - QFP - SOJ - PLCC With an infrared area of basic 30 * 55 mm , and 11 Kg of weight, this is the big one of the Multi Purpose IC INFRARED IRDA Welders. 850W of heating power, Output of 1000W and a heating plate of 240*180mm.This rework station is ESD-Safe and it is made of metal and coated with a static-dissipative paint and allows for Soldering and desoldering all types of chips.DGC Media for 2009 presents a new Educational Series dedicated to interact directly... more
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DGCTV
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2 years ago
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The most advanced BGA Rework Reballing SMD SMT Station by Jovy Systems. Controlled by computer and with totally SMART DIGITAL System. with pre-profiles and customized options for your projects.
Specifications
• Top heater Power :300W
• Pre heater Power:600W
• Voltage frequency:220 volts 50/60 HZ
• Max board Size:350mm x 450 mm
• Weight:16KG
Packing included:
JOVY 7500 BGA Station
Infrared Ray Device
Infrared Device Holder
X-Y Table Support
Rework tray With Preheating Plate
Thermocouple and Suction Chip Pen Included
Software for JOVY RE 7500 Station
Manuals available in 5 languages, support worldwide. Super technology one click away from you
Get it today in Dragon Group China, any of our online stores or websites or your Jovy system
distributor near you. If you have any question please do not hesitate
stores@dragongroupchina.com
Category: Science & Technology
Tags:
Jovy Reballing BGA Rework Welder SMT SMD Profile Customizable Smart Digital Computer Controlled Laser Infrared IRDA 7500 Technology versus future Bluetooth Mobile Xbox 360 PS3 PS2 Repair Playstation Main Board Nvidia Gforce SoundBlaster Laptop Compaq HP DELL Lenovo Notebook Netbook Ring of Death red circlesThe most advanced BGA Rework Reballing SMD SMT Station by Jovy Systems. Controlled by... more
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DGCTV
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2 years ago
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DGC Media for 2009 presents a new Educational Series dedicated to interact directly with our customer, This series are dedicated to help you with you procedures of reballing, rework, from the beginning.
Chose the right machine for the job, the right accessories and parts and perform a clean cut procedure that guarantees the best functionality for the chips and motherboards.
This is just a video of the USE of the T-862 3 in 1.
This machine can work with kind of chips from 5 to 25mm.
BGA , Mini BGA - SMT - SMD - SOP - QFP - SOJ - PLCC With an infrared area of basic 18 * 18 mm , and 8 Kg of weight, this is the baby of the Multi Purpose IC INFRARED IRDA Welders.
650W of heating power, Output of 800W and a heating plate of 120*60mm.This rework station is ESD-Safe
and it is made of metal and coated with a static-dissipative paint and allows for Soldering and desoldering BGA, Mini BGA, QFP, SOP, PLCC or SOJ.
Get it Today:
stores.ebay.com/Dragon-Lair-China
Specification:
Power Voltage: 220V AC or 110V
Power Consumption: 800W (Max.)
Preheating Area: 120*80mm (Max.)
Leakage Voltage of Iron Tip: 0.5mV
Standard Iron Tip: AT-900M
Tip of Iron Temperature: 100℃-350℃
Also Dragon Group China R & D developed the RBSN3 , Reballing Station N 3, for 75 mm in-mold-static net procedure.
That you can get with Squeezing Pen, Masking Tape and Insulation tape, directly from the Makers to you. Also all the Stencils: Universal, Plain and Special, for all your needs.
Get the Reballing Station at:
stores.ebay.com/Dragon-Empire-China
TAGS:
Soldering Station Welder Rework Puhui 862++ 862 862D++ 862D 862D+ T-862 T-862++ T862 T862++ T-862D T870 T-870 T-870A T870A T860 T-860 Infrared IC Heater T962A T-962A T962 T-962 Preheating T-8120 T-8120 T-835 835 T835 Manufacture Taian China Factory Chinese Technology DGC BGA Mini QFP SOP PLCC SOJ Iron ELECTRICITY IRDA INFRAREDDGC Media for 2009 presents a new Educational Series dedicated to interact directly... more
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DGCTV
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added this
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2 years ago
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DGC Media for 2009 presents a new Educational Series dedicated to interact directly with our customer, This series are dedicated to help you with you procedures of reballing, rework, from the beginning.
Chose the right machine for the job, the right accessories and parts and perform a clean cut procedure that guarantees the best functionality for the chips and motherboards.
This is just a video of the USE of the T-862++ 3 in 1.
This machine can work with kind of chips from 30 to 45mm.
BGA , Mini BGA - SMT - SMD - SOP - QFP - SOJ - PLCC With an infrared area of basic 20 * 45 mm , and 9 Kg of weight, this is the baby of the Multi Purpose IC INFRARED IRDA Welders.
650W of heating power, Output of 800W and a heating plate of 120*120mm.This rework station is ESD-Safe
and it is made of metal and coated with a static-dissipative paint and allows for Soldering and desoldering all types of chips, is the most recommended one for the:
Intel 945
Envidia
ATI
GPU Xbox and HANA Chips
Get it Today:
stores.ebay.com/Dragon-Soul-China
Specification:
Power Voltage: 220V AC or 110V
Power Consumption: 800W (Max.)
Preheating Area: 120*120mm (Max.)
Leakage Voltage of Iron Tip: 0.5mV
Standard Iron Tip: AT-900M
Tip of Iron Temperature: 100℃-350℃
Also Dragon Group China R & D developed the RBSN3 , Reballing Station N 3, for 75 mm in-mold-static net procedure.
That you can get with Squeezing Pen, Masking Tape and Insulation tape, directly from the Makers to you. Also all the Stencils: Universal, Plain and Special, for all your needs.
TAGS:
Soldering Station Welder Rework Puhui 862++ 862 862D++ 862D 862D+ T-862 T-862++ T862 T862++ T-862D T870 T-870 T-870A T870A T860 T-860 Infrared IC Heater T962A T-962A T962 T-962 Preheating T-8120 T-8120 T-835 835 T835 Manufacture Taian China Factory Chinese Technology DGC BGA Mini QFP SOP PLCC SOJ Iron ELECTRICITY IRDA INFRARED Reballing Xbox HANA Intel 945 ATI Envidia Chips GPUDGC Media for 2009 presents a new Educational Series dedicated to interact directly... more
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DGCTV
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2 years ago
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National NanoFab Center (NNFC) in Korea, Stanford NanoFab (SNF), and BeSang Inc claim to have developed a breakthrough 3D IC technology which enables low-cost memories and high-performance logic products with large embedded memory blocks.
Processed on 8-inch wafers with industry standard 0.18µm CMOS technologies both at NNFC and SNF, this 3D IC contains 128 million vertically oriented devices as a test vehicle. It is uniquely processed at low temperatures, below 400°C. A submicron thick single crystalline silicon layer is initially formed above the silicon substrate with two metal interconnect layers, followed by vertical devices and an additional metal layer.
Unlike conventional semiconductor technologies with planar devices on the surface of the semiconductor substrate and interconnects only above the planar devices, this technology forms full 3D interconnects below and above the vertical devices.
"One of the unique features of BeSang's 3D IC is the capability of unrestricted 3D interconnections using conventional via technologies that does not require wafer alignment nor through-silicon vias for 3D interconnects," said Dr Yoshio Nishi, head of SNF and professor at Stanford University. "Conventional CMOS technology is facing its scaling limits. Therefore, this emerging 3D IC technology will extend the lifespan of CMOS technology, because it is an excellent alternative way to accommodate more devices on a given wafer area."
Chip level 3D IC has been explored for many years by the semiconductor industry. However, market introduction of chip level 3D IC has been delayed due to technical challenges, including high-temperature processing, defects in semiconductor layers, limited 3D interconnections, and a complex process. BeSang said it provides solutions to these problems and has successfully generated high-performance and reliable devices on single crystalline silicon layers that are subsequently formed above another silicon substrate at low temperature.
This 3D IC concept was successfully demonstrated by BeSang at SNF in early 2007 and has been further developed at the commercial level technologies at NNFC since July 2007.
BeSang's 3D IC technology with vertical devices aims at an innovative, simpler, and more cost-effective way to enhance large functional blocks, such as memory arrays or photodiodes for image sensors, SoC, MPUs, and memory control logic circuitry in advanced semiconductor chips. National NanoFab Center (NNFC) in Korea, Stanford NanoFab (SNF), and BeSang Inc claim... more
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